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Número de resultados: 79

DIN EN IEC 61837-2:2021-06  DIN

Estado: Active / 2021-06

Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-2:2018 + A1:2020); German version EN IEC 61837-2:2018 + A1:2020 / Note: DIN EN IEC 61837-2 (2019-02) remains valid alongside this standard until 2023-10-29.

DIN EN IEC 60191-1:2018-10  DIN

Estado: Active / 2018-10

Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 60191-1:2018); German version EN IEC 60191-1:2018 / Note: DIN EN 60191-1 (2007-11) remains valid alongside this standard until 2021-02-27.

DIN EN 61240:2017-08  DIN

Estado: Active / 2017-08

Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules (IEC 61240:2016); German version EN 61240:2017) / Note: DIN EN 61240 (2013-05) remains valid alongside this standard until 2019-11-28.

DIN EN 60191-3 Beiblatt 1:2006-08  DIN

Estado: Active / 2016-08

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Supplement 1: Extract of the terms

DIN EN 60191-6-10:2004-05  DIN

Estado: Active / 2014-05

Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON (IEC 60191-6-10:2003); German version EN 60191-6-10:2003

DIN EN 60191-6-4:2004-01  DIN

Estado: Active / 2014-01

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (IEC 60191-6-4:2003); German version EN 60191-6-4:2003

DIN EN 60191-6-22:2013-08  DIN

Estado: Active / 2013-08

Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (IEC 60191-6-22:2012); German version EN 60191-6-22:2013

DIN 1304-9:2003-01  DIN

Estado: Active / 2013-01

Letter symbols for physical quantities - Part 9: Symbols for equivalent circuits of piezoelectric crystals

DIN EN 60191-6-2:2002-09  DIN

Estado: Active / 2012-09

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages (IEC 60191-6-2:2001); German version EN 60191-6-2:2002

DIN EN 60191-6-1:2002-08  DIN

Estado: Active / 2012-08

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals (IEC 60191-6-1:2001); German version EN 60191-6-1:2001 / Note: To be replaced by DIN IEC 60191-6-1 (2010-07).

DIN EN 60191-6-8:2002-05  DIN

Estado: Active / 2012-05

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP) (IEC 60191-6-8:2001); German version EN 60191-6-8:2001

DIN EN 60191-6-5:2002-05  DIN

Estado: Active / 2012-05

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA) (IEC 60191-6-5:2001); German version EN 60191-6-5:2001 / Note: To be replaced by DIN IEC 60191-6-5 (2010-01).

DIN EN 60191-6-6:2002-02  DIN

Estado: Active / 2012-02

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine pitch land grid array (FLGA) (IEC 60191-6-6:2001); German version EN 60191-6-6:2001

DIN EN 60191-6-12:2011-12  DIN

Estado: Active / 2011-12

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA) (IEC 60191-6-12:2011); German version EN 60191-6-12:2011 / Note: DIN EN 60191-6-12 (2003-01) remains valid alongside this standard until 2014-07-13.

DIN EN 60139:2001-10  DIN

Estado: Active / 2011-10

Preparation of outline drawings for cathode-ray tubes, their components, connections and gauges (IEC 60139:2000); German version EN 60139:2001

DIN EN 60191-6-17:2011-09  DIN

Estado: Active / 2011-09

Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) (IEC 60191-6-17:2011); German version EN 60191-6-17:2011

DIN EN 60191-6-3:2001-06  DIN

Estado: Active / 2011-06

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quat flat packs (QFP) (IEC 60191-6-3:2000); German version EN 60191-6-3:2000

DIN EN 60191-6-21:2011-03  DIN

Estado: Active / 2011-03

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010); German version EN 60191-6-21:2010

DIN EN 60191-6-20:2011-03  DIN

Estado: Active / 2011-03

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010); German version EN 60191-6-20:2010

DIN EN 60191-6-18:2010-08  DIN

Estado: Active / 2010-08

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (IEC 60191-6-18:2010 + Cor. :2010); German version EN 60191-6-18:2010

DIN EN 60191-3:2000-07  DIN

Estado: Active / 2010-07

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits (IEC 60191-3:1999); German version EN 60191-3:1999

DIN EN 60191-6:2010-06  DIN

Estado: Active / 2010-06

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009); German version EN 60191-6:2009 / Note: DIN EN 60191-6 (2005-04) remains valid alongside this standard until 2012-12-01.

BS IEC 60191-2:1966+A21:2020  BSI

Estado: Definitive / 2020-04-02

Mechanical standardization of semiconductor devices. Dimensions

15/30328077 DC  BSI

Estado: Definitive / 2015-07-07

BS EN 60191-2. Mechanical standardization of semiconductor devices. Part 2. Dimensions

13/30290470 DC  BSI

Estado: Definitive / 2013-09-11

BS EN 60191-2/F71. Proposed new package outline. P-ZMP-P89

BS EN 60848:2013  BSI

Estado: Definitive / 2013-07-31

GRAFCET specification language for sequential function charts

BS EN 60191-6-12:2011  BSI

Estado: Definitive / 2011-08-31

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guidelines for fine-pitch land grid array (FLGA)

BS EN 60191-6-17:2011  BSI

Estado: Under Review / 2011-06-30

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for stacked packages. Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)

BS EN 60191-6-2:2002, IEC 60191-6-2:2001  BSI

Estado: Definitive / 2003-03-04

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

BS EN 60191-6-1:2001, IEC 60191-6-1:2001  BSI

Estado: Revision Underway / 2002-03-29

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for gull-wing lead terminals

BS EN 60191-6-8:2001, IEC 60191-6-8:2001  BSI

Estado: Under Review / 2001-11-16

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for glass sealed ceramic quad flatpack (G-QFP)

BS EN 60191-6-5:2001, IEC 60191-6-5:2001  BSI

Estado: Under Review / 2001-11-15

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for fine-pitchball grid array (FBGA)

BS EN 60191-6-6:2001, IEC 60191-6-6:2001  BSI

Estado: Definitive / 2001-09-05

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for fine pitch land grid array (FLGA)

BS EN 60139:2001, IEC 60139:2000  BSI

Estado: Definitive / 2001-08-15

Preparation of outline drawings for cathode-ray tubes, their components, connections and gauges

BS EN 60191-6-3:2001, IEC 60191-6-3:2001  BSI

Estado: Definitive / 2001-05-15

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of quad flat packs (QFP)

BS EN 60191-3:2000, IEC 60191-3:1999  BSI

Estado: Definitive / 2000-06-15

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of integrated circuits

DIN EN IEC 61837-2:2019-02  DIN

Estado: Withdrawn / 2021-06

Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-2:2018); German version EN IEC 61837-2:2018 / Note: DIN EN 61837-2 (2014-10) remains valid alongside this standard until 2021-06-12.*A transition period, as set out in DIN EN IEC 61837-2 (2021-06), exists until 2023-10-29.

DIN EN IEC 61837-2/A1:2020-12  DIN

Estado: Withdrawn / 2021-06

Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 49/1338/CDV:2020); German and English version EN IEC 61837-2:2018/prA1:2020 / Note: Date of issue 2020-11-13

DIN EN 61837-2:2014-10  DIN

Estado: Withdrawn / 2019-02

Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-2:2011 + A1:2014); German version EN 61837-2:2011 + A1:2014 / Note: DIN EN 61837-2 (2012-04) remains valid alongside this standard until 2017-04-18.*A transition period, as set out in DIN EN IEC 61837-2 (2019-02), exists until 2021-06-12.

DIN EN 60191-1:2007-11  DIN

Estado: Withdrawn / 2018-10

Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 60191-1:2007); German version EN 60191-1:2007 / Note: A transition period, as set out in DIN EN IEC 60191-1 (2018-10), exists until 2021-02-27.

DIN EN 60191-1:2017-05  DIN

Estado: Withdrawn / 2018-10

Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 47D/886/CDV:2016); German version prEN 60191-1:2016 / Note: Date of issue 2017-04-28

DIN EN 61240:2015-08  DIN

Estado: Withdrawn / 2017-08

Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules (IEC 49/1141/CD:2015) / Note: Date of issue 2015-07-31

DIN EN 61240:2013-05  DIN

Estado: Withdrawn / 2017-08

Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules (IEC 61240:2012); German version EN 61240:2012 / Note: DIN EN 61240 (1997-09) remains valid alongside this standard until 2015-08-29.*A transition period, as set out in DIN EN 61240 (2017-08), exists until 2019-11-28.

DIN-Fachbericht IEC/PAS 62515:2008-12  DIN

Estado: Withdrawn / 2016-02

Requirements concerning the interoperability between electromechanical and electrical applications in CAx-systems; German version IEC/PAS 62515:2007

DIN EN 60191-6-16:2013-08  DIN

Estado: Withdrawn / 2015-12

Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA (IEC 47D/835/CD:2013) / Note: Date of issue 2013-08-12

DIN EN 60191-6:2001-07  DIN

Estado: Withdrawn / 2015-04

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 47D/392/CDV:2000); German version prEN 60191-6:2000

DIN IEC 60191-6-5:2010-01  DIN

Estado: Withdrawn / 2015-01

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) (IEC 47D/755/CD:2009) / Note: Date of issue 2010-01-18

DIN EN 61837-2/A1:2013-08  DIN

Estado: Withdrawn / 2014-10

Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 49/1028/CD:2013) / Note: Date of issue 2013-08-05

DIN EN 61837-2:2012-04  DIN

Estado: Withdrawn / 2014-10

Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-2:2011); German version EN 61837-2:2011 / Note: DIN EN 61837-2 (2001-09) remains valid alongside this standard until 2014-07-01.*A transition period, as set out in DIN EN 61837-2 (2014-10), exists until 2017-04-18.

DIN EN 60191-4:2003-03  DIN

Estado: Withdrawn / 2014-10

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:1999 + A1:2001 + A2:2002); German version EN 60191-4:1999 + A1:2002 + A2:2002 / Note: DIN EN 60191-4 (2002-08) remains valid alongside this standard until 2005-10-01.*A transition period, as set out in DIN EN 60191-4 (2014-10), exists until 2016-11-14.

Número de resultados: 79

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