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Normas SAE – AENOR
SAE ARP1332

SAE ARP1332

Wave Soldering Procedure

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Fecha publicación:
1974-03-01 /Issued
Abstract:
The purpose of this recommended practice is to provide recommendations concerning the procedure for wave soldering. The detailed recommendations are based on manufacturing experience and laboratory experiments. The recommendations reflect those design practices and fabricating procedures which have been found to be most effective in producing functional electronic modules for critical communications or control systems. Electronic modules include assemblies, components, and printed circuit (PC) or printed wire (PW) boards. In the following text, references to printed circuit (PC) boards shall be construed to included printed wire (PW) boards.
71,05
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