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Normas IEC internacionales electrotécnicas - AENOR
IEC PAS 62173:2000

IEC PAS 62173:2000

Solderability test method

Fecha:
2000-08-22 /Anulada
Resumen (inglés):
Provides a means of determining the solderability of device package terminations that are intended to be joined to another surface using solder for the attachment. Provides also optional conditions for ageing and soldering for the purpose of allowing simulation of the soldering process to be used in the device application.
Resumen (francés):
98,28
Idioma Formato

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