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Normas IEC internacionales electrotécnicas - AENOR
IEC 60068-2-58:1999

IEC 60068-2-58:1999

Environmental testing - Part 2-58: Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Fecha:
1999-01-15 /Anulada
Resumen (inglés):
Provides standard procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices. The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow system.
Resumen (francés):
97,11
Idioma Formato

Nota: Precios sin IVA ni gastos de envío

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