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Normas DIN – AENOR
DIN IEC 62137-1-3:2006-12

DIN IEC 62137-1-3:2006-12

Surface-mount technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test (IEC 91/614/CD:2006)

Oberflächenmontage-Technik - Verfahren zur Prüfung auf Umgebungseinflüsse und Prüfung der Haltbarkeit von Oberflächen-Lötverbindungen - Teil 1-3: Zyklische Fallprüfung (IEC 91/614/CD:2006)

Fecha Anulación:
2019-07 /Withdrawn
Equivalencias internacionales:

IEC 91/614/CD (2006)

Relación con otras normas DIN:

Reemplazada por: DIN EN 62137-1-3:2009-07

Resumen:
This standard applies to cyclic drop tests for solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs).
Die vorliegende Norm gilt für zyklische Fallprüfungen für Lötverbindungen zwischen Anschlüssen von oberflächenmontierbaren Bauelementen (SMD) und Anschlussflächen auf Leiterplatten (PWB).
Keywords:
Bend testing, Changes of temperature, Continuity tests, Definitions, Discrete devices, Drop tests, Durability, Electrical engineering, Electronic engineering, Electronic equipment and components, Endurance testing, Endurance tests, Environmental testing, Integrated circuits, Life (durability), Materials testing, Operating temperatures, Reliability, Semiconductor devices, SMD, Soldered joints, Soldering points, Surface mounting, Surface mounting devices, Temperature cycles, Temperature resistant, Test on changes of temperature, Testing, Thermal cycling, Thermal shock endurance, Thermal shock resistance
72,24
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