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Normas DIN – AENOR
DIN EN 60191-2-50:2001-07

DIN EN 60191-2-50:2001-07

Mechanical standardization for semiconductor devices - Plastic low profile quad flatpack (HLQFP) - Outline family, heat slug down (IEC 47D/407/CDV:2000); German version prEN 60191-2-50:2000

Mechanische Normung für Halbleiterbauelemente - Plastik-HLQFP-Gehäusefamilie - Kühlkörper unten (IEC 47D/407/CDV:2000); Deutsche Fassung prEN 60191-2-50:2000

Fecha Anulación:
2016-04 /Withdrawn
Equivalencias internacionales:

IEC 47D/407/CDV (2000-12)

prEN 60191-2-50

Resumen:
The document specifies Plastic Low Profile Quad Flatpack (HLQFP) Outline Family with Heat Slug Down.
Das Dokument legt eine Plastik-HLQFP-Gehäusefamilie mit Kühlkörper unten fest.
Keywords:
Case drawing, Components, Connections, Design, Diameter, Dimensions, Electric enclosures, Electrical engineering, Electronic engineering, Electronic equipment and components, Enclosures, Engineering drawings, Erecting (construction operation), Heat sink, Integrated circuits, Marking, Mechanic, Mechanics, Plastics case, Replaceability, Semiconductor devices, Semiconductors, Standardization
70,84
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