Keywords:
Base materials, Copper foils, Copper-clad, Designations, Dimensions, Electrical engineering, Electrical properties and phenomena, Electronic engineering, Electronic equipment and components, Finishes, Flexible, Foil, Inspection, Laminated sheets, Materials, Multilayer printed boards, Packages, Printed circuits, Production, Properties, Semi-finished products, Special materials, Specification (approval), Strength of materials, Surfaces, Testing, Tolerances (measurement)