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Normas DIN – AENOR
DIN 50002-1:2020-03

DIN 50002-1:2020-03

Adhesive bondings in electronic applications - Bonding strength on surfaces - Part 1: Tensile test

Collages adhésives dans des applications électroniques - Adhérence aux surfaces - Partie 1: Essai de traction

Klebungen in elektronischen Anwendungen - Haftfestigkeit an Oberflächen - Teil 1: Zugprüfung

Fecha:
2020-03 /Active
Relación con otras normas DIN:

Reemplaza a: DIN 50002-1:2019-07

Resumen:
This standard specifies a test method for the assessment of the bondability of elements and for the determination of adhesive and compound characteristics using a cross tension test with tensile members such as headnails, pins and dollies.
Keywords:
Adhesion, Adhesive strength, Adhesives, Bonding, Components, Compounds, Definitions, Electronic engineering, Electronic equipment and components, Fragmentation tests, Gellings, Materials testing, Sample preparation, Specimens, Surfaces, Tensile tests, Test performance, Testing, Testing devices
65,98
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Formato digital

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