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Normas DIN – AENOR
DIN 50002-1:2020-03

DIN 50002-1:2020-03

Adhesive bondings in electronic applications - Bonding strength on surfaces - Part 1: Tensile test

Collages adhésives dans des applications électroniques - Adhérence aux surfaces - Partie 1: Essai de traction

Klebungen in elektronischen Anwendungen - Haftfestigkeit an Oberflächen - Teil 1: Zugprüfung

2020-03 /Active
Relación con otras normas DIN:

Reemplaza a: DIN 50002-1:2019-07

This standard specifies a test method for the assessment of the bondability of elements and for the determination of adhesive and compound characteristics using a cross tension test with tensile members such as headnails, pins and dollies.
Adhesion, Adhesive strength, Adhesives, Bonding, Components, Compounds, Definitions, Electronic engineering, Electronic equipment and components, Fragmentation tests, Gellings, Materials testing, Sample preparation, Specimens, Surfaces, Tensile tests, Test performance, Testing, Testing devices
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