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DIN IEC 47D/170/CDV:1997-09

DIN IEC 47D/170/CDV:1997-09

Semiconductor devices - Mechanical standardization - General rules for TSOP (Thin small outline package) Type II (IEC 47D/170/CDV:1997)

Halbleiterbauelemente - Mechanische Normung - Allgemeine Regeln für TSOP-Gehäuse Typ II (IEC 47D/170/CDV:1997)

Fecha Anulación:
2014-03 /Withdrawn
ICS:

31.240 - Mechanical structures for electronic equipment

Equivalencias internacionales:

IEC 47D/170/CDV (1997-04)

Resumen:
The document specifies general rules for TSOP (Thin small outline package) Type II.
Das Dokument legt allgemeine Regeln für TSOP-Gehäuse Typ II fest.
Keywords:
Case drawing, Definitions, Design, Drawings, Electrical engineering, Enclosures, Engineering drawings, Illustrations, Mechanic, Semiconductor devices, Semiconductor package, Standardization
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