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Normas DIN – AENOR
DIN IEC 47D/145/CDV:1997-01

DIN IEC 47D/145/CDV:1997-01

Semiconductor devices, mechanical standardization - Tape ball grid array outline package (TBGA) family (IEC 47D/145/CDV:1996)

Halbleiterbauelemente, mechanische Normung - Tape-Ball-Grid-Array-Gehäusefamilie (TBGA) (IEC 47D/145/CDV:1996)

Fecha Anulación:
2014-04 /Withdrawn
Equivalencias internacionales:

IEC 47D/145/CDV (1996-10)

Resumen:
The document specifies a tape ball grid array outline package (TBGA) family.
Das Dokument legt eine Tape-Ball-Grid-Array-Gehäusefamilie (TBGA) fest.
Keywords:
Classification, Dimensions, Electric enclosures, Electrical engineering, Electronic engineering, Electronic equipment and components, Enclosures, Integrated circuits, Marking, Semiconductor devices, Semiconductors, Symbols, Types
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