Resumen:
The document contains information about component dimensions, land pattern dimensions, tolerance and solder joint analysis for discrete components.
Das Dokument enthält Angaben über Abmessungen von Bauelementen, Anschlußflächenbildern, sowie Auswertungen von Grenzabweichungen und Lötverbindungen für Einzelbauelemente.
Keywords:
Applications, Assemblies, Chips, Components, Design, Developments, Dimensions, Discrete devices, Electrical engineering, Electronic engineering, Electronic equipment, Electronic equipment and components, Erecting (construction operation), Manufacturing, Packages, Printed-circuit boards, Resistance, Soldered joints, Specification (approval), Structural systems, Subracks