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Normas DIN – AENOR
DIN IEC 52/570/CD:1996-02

DIN IEC 52/570/CD:1996-02

IEC 61189-2: Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (IEC 52/570/CD:1995)

IEC 61189-3: Prüfverfahren für Elektromaterialien, Verbindungsstrukturen und Baugruppen - Teil 3: Prüfverfahren für Verbindungsstrukturen (IEC 52/570/CD:1995)

Fecha Anulación:
2010-08 /Withdrawn
Equivalencias internacionales:

IEC 52/570/CD (1995)

Relación con otras normas DIN:

Reemplazada por: DIN EN 61189-3:2000-08

Resumen:
The document contains test methods for interconnection structures.
Das Dokument enthält Prüfverfahren für Verbindungsstrukturen.
Keywords:
Abrasion resistance, Ageing (materials), Base materials, Coatings, Combustibility, Dielectric strength, Dimensions, Electrical components, Electrical engineering, Electronic equipment and components, Interconnection, Interconnection structures, Materials testing, Multilayer printed boards, Prepreg, Printed circuits, Printed-circuit bases, Printed-circuit boards, Strength of materials, Testing, Variation of resistance, Visual inspection (testing)
97,76
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Formato digital

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