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Normas DIN – AENOR
DIN EN 16603-31-02:2014-09

DIN EN 16603-31-02:2014-09

Space engineering - Two-phase heat transport equipment; English version FprEN 16603-31-02:2014 / Note: Date of issue 2014-08-15

Ingénierie spatiale - Equipements de transfert de chaleur à deux phases; Version anglaise FprEN 16603-31-02:2014 / Attention: Date de parution 2014-08-15

Raumfahrttechnik - Ausrüstung für Zwei-Phasen-Wärmetransport; Englische Fassung FprEN 16603-31-02:2014 / Achtung: Erscheinungsdatum 2014-08-15

Fecha Anulación:
2015-12 /Withdrawn
Equivalencias internacionales:

FprEN 16603-31-02 (2014-05)

Relación con otras normas DIN:

Reemplazada por: DIN EN 16603-31-02:2015-12

This standard defines requirements for two-phase heat transportation equipment (TPHTE), for use in spacecraft thermal control. This standard is applicable to new hardware qualification activities.Requirements for mechanical pump driven loops (MPDL) are not included in the present version of this Standard.This standard includes definitions, requirements and DRDs from ECSS-E-ST-10-02, ECSS-E-ST-10-03, and ECSS-E-ST-10-06 applicable to TPHTE qualification. Therefore, these three standards are not applicable to the qualification of TPHTE.This standard also includes definitions and part of the requirements of ECSS-E-ST-32-02 applicable to TPHTE qualification.ECSS-E-ST-32-02 is therefore applicable to the qualification of TPHTE.This standard does not include requirements for acceptance of TPHTE.This standard may be tailored for the specific characteristic and constrains of a space project in conformance with ECSS-S-ST-00.
Aerospace transport, Commissioning, Control equipment, Definitions, Equipment, Hardware, Heat transfer, Mechanical interfaces, Mechanics, Operation, Outer space, Performance, Performance tests, Properties, Quality assurance, Reliability, Safety, Space safety, Space technology, Space transport, Space vehicles, Spacecraft, Spacecraft instruments, Specification (approval), Surveillance (approval), Temperature, Testing, Thermal, Thermal environment, Thermal stress
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