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Normas DIN – AENOR
DIN EN 62047-10:2012-03

DIN EN 62047-10:2012-03

Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials (IEC 62047-10:2011); German version EN 62047-10:2011

Dispositifs à semiconducteur - Dispositifs microélectromécaniques - Partie 10: Essai de compression utilisant la technique des micro-piliers pour les matériaux des MEMS (CEI 62047-10:2011); Version allemande EN 62047-10:2011

Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 10: Druckprüfverfahren an zylinderförmigen Mikroproben für Werkstoffe der Mikrosystemtechnik (IEC 62047-10:2011); Deutsche Fassung EN 62047-10:2011

Fecha:
2012-03 /Active
Equivalencias internacionales:

EN 62047-10 (2011-09)

IEC 62047-10 (2011-07)

Relación con otras normas DIN:
Resumen:
This document specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a specimen is measured, and the compressive modulus of elasticity and yield strength can be obtained.
Keywords:
Compression, Compression stresses, Compression tests, Dimensions, Electrical engineering, Materials, Measurement, Measuring techniques, Microelectronics, Microsystem techniques, Pressure tests, Properties, Samples, Semiconductor devices, System engineering, Tensile strain, Tensile testing, Testing, Testing devices, Testing system, Thin films, Thin-film devices, Thin-film technology
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