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Normas DIN – AENOR
DIN EN 61191-6:2011-01

DIN EN 61191-6:2011-01

Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method (IEC 61191-6:2010); German version EN 61191-6:2010

Ensembles de cartes imprimées - Partie 6: Critères d'évaluation des vides dans les joints brasés des boîtiers BGA et LGA et méthode de mesure (CEI 61191-6:2010); Version allemande EN 61191-6:2010

Elektronikaufbauten auf Leiterplatten - Teil 6: Bewertungskriterien für Hohlräume in Lötverbindungen von BGA und LGA und Messmethode (IEC 61191-6:2010); Deutsche Fassung EN 61191-6:2010

Fecha:
2011-01 /Active
Equivalencias internacionales:

EN 61191-6 (2010-04)

IEC 61191-6 (2010-01)

Relación con otras normas DIN:
Resumen:
This part of IEC 61191 specifies the evaluation criteria for voids on the scale of the thermal cycle life, and the measurement method of voids using X-ray observation. This part of IEC 61191 is applicable to the voids generated in the solder joints of BGA and LGA soldered on a board. This part of IEC 61191 is not applicable to the BGA package itself before it is assembled on a board.
Keywords:
Cavity, Definitions, Electrical engineering, Electrically-operated devices, Electronic engineering, Electronic equipment and components, Electronically-operated devices, Evaluations, Measurement, Measuring techniques, Printed circuits, Printed-circuit boards, Sectional specification, SMD, Soldered, Soldered joints, Solderings, Specification, Specification (approval), Surface mounting, X-ray, X-ray analysis
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