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Normas DIN – AENOR
DIN IEC 61760-3:2008-09

DIN IEC 61760-3:2008-09

Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering (IEC 91/777/CD:2008) / Note: Date of issue 2008-09-29

/ Attention: Date de parution 2008-09-29

Oberflächenmontagetechnik - Teil 3: Genormtes Verfahren zur Spezifizierung von Durchsteckmontage-Bauelementen für das Aufschmelzlöten (THR) (IEC 91/777/CD:2008) / Achtung: Erscheinungsdatum 2008-09-29

Fecha Anulación:
2010-12 /Withdrawn
Equivalencias internacionales:

IEC 91/777/CD (2008-07)

Relación con otras normas DIN:

Reemplazada por: DIN EN 61760-3:2010-12

Resumen:
The scope of this standard is all specifications of electronic components that are intended for usage in through hole reflow soldering technology.
Der Anwendungsbereich dieser Norm umfasst alle Spezifikationen von elektronischen Bauelementen, welche für die Durchsteckmontage mit Aufschmelzlötverfahren bestimmt sind.
Keywords:
Capillary brazing joints, Components, Coordination, Definitions, Electrical engineering, Electronic engineering, Electronic equipment and components, Erecting (construction operation), Guide books, Inspection, Marking, Quality assurance, Reflow soldering, SMD, Soldered joints, Soldering equipment, Soldering points, Solderings, Specification, Specification (approval), Suitability, Surface mounting, Surface mounting devices, Testing, Testing conditions, Trough-hole mounting
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