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Normas DIN – AENOR
DIN IEC 60068-2-83:2007-09

DIN IEC 60068-2-83:2007-09

Environmental Testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using lead-free solder paste (IEC 91/682/CD:2007)

Umweltprüfungen - Teil 2-83: Prüfungen - Prüfung Tf: Prüfung der Lötbarkeit von Bauelementen der Elektronik für Oberflächenmontage (SMD) mit der Benetzungswaage unter Verwendung von Lotpaste (IEC 91/682/CD:2007)

Fecha Anulación:
2012-07 /Withdrawn
Equivalencias internacionales:

IEC 91/682/CD (2007-04)

Relación con otras normas DIN:

Reemplazada por: DIN EN 60068-2-83:2012-07

Resumen:
This part of IEC 60068 outlines test Tf, solderability test for surface mounting devices (SMD) by wetting balance method using solder paste.
Dieser Teil der IEC 60068 beschreibt die Prüfung Tf, Lötbarkeit von oberflächenmontierbaren Bauelementen (SMD) mit der Benetzungswaage unter Verwendung von Lotpaste.
Keywords:
Base materials, Brazing, Climate, Climatic tests, Components, Conditions, Definitions, Dissolution, Electric appliances, Electrical appliances, Electrical components, Electrical engineering, Electronic engineering, Electronic equipment and components, Electrotechnical products, Environmental testing, Erecting (construction operation), Finishes, Heat up, Hot dip coating, Hot-dip coating, Measurement, Measuring techniques, Metallic, Metallic materials, Metallization, Metallized, Non-leaded, Paste solder, SMD, Solderability, Solderability testing, Soldering, Soldering bath method, Soldering heat, Soldering pastes, Soldering temperature resistance, Solderings, Specification (approval), Strength of materials, Surface layer, Surface mounting, Surface mounting devices, Surfaces, Temperature profile, Test temperatures, Testing, Testing conditions, Testing requirements, Thermal stability, Wetting balances
95,14
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