Saltar navegación principal
Normas BSI – AENOR
BS EN 61191-3:2017

BS EN 61191-3:2017

Printed board assemblies. Sectional specification. Requirements for through-hole mount soldered assemblies

Fecha:
2017-09-25 /Definitive
Comité:
EPL/501
Equivalencias internacionales:

EN 61191-3:2017

IEC 61191-3:2017

Relación con otras normas BSI:

Reemplaza a: BS EN 61191-3:1999

Resumen:

This part of IEC 61191 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).

Keywords:
Printed-circuit boards, Electrical components, Joints, Printed circuits, Soldering, Holes, Wires, Boards, Microassembling, Electrical equipment, Defects, Surface properties, Electronic equipment and components, Integrated circuits, Semiconductor devices
204,53
Idioma Formato

Formato digital

Nota: Precios sin IVA ni gastos de envío

Añadir a la cesta