Printed board assemblies. Sectional specification. Requirements for through-hole mount soldered assemblies
31.180 - Printed circuits and boards
31.240 - Mechanical structures for electronic equipment
Reemplaza a: BS EN 61191-3:1999
This part of IEC 61191 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
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