BS EN 61191-3:2017

Printed board assemblies. Sectional specification. Requirements for through-hole mount soldered assemblies

Información:

Fecha:

2017-09-25 /Definitive

ICS:

31.180 - Printed circuits and boards

31.240 - Mechanical structures for electronic equipment

Comité:

EPL/501

Equivalencias internacionales:

EN 61191-3:2017

IEC 61191-3:2017

Relación con otras normas BSI:

Reemplaza a: BS EN 61191-3:1999

Resumen:

This part of IEC 61191 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).

Keywords:

Printed-circuit boards, Electrical components, Joints, Printed circuits, Soldering, Holes, Wires, Boards, Microassembling, Electrical equipment, Defects, Surface properties, Electronic equipment and components, Integrated circuits, Semiconductor devices

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