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Normas BSI – AENOR
BS EN 61189-5-3:2015

BS EN 61189-5-3:2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering paste for printed board assemblies

Fecha:
2015-04-30 /Definitive
Comité:
EPL/501
Equivalencias internacionales:

EN 61189-5-3:2015

Resumen:
IEC 61189-5-3:2015 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods for soldering paste based on the existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods of soldering paste for lead free soldering.
Keywords:
Printed circuits, Electronic equipment and components, Fluxes (materials), Printed-circuit boards, Electrical insulating materials, Mechanical testing, Visual inspection (testing), Chemical analysis and testing, Electrical testing, Dimensional measurement, Environmental testing, Soldering
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