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Normas BSI – AENOR
PD IEC/TR 60068-3-12:2014

PD IEC/TR 60068-3-12:2014

Environmental testing. Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile

2014-10-17 /Definitive
Equivalencias internacionales:

IEC TR 60068-3-12:2014

Relación con otras normas BSI:

This part of IEC 60068 , which is a technical report, presents two approaches for establishing a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste.

This process covers a great variety of electronic products, including a large range of package sizes (e.g. molded active electronic components, passive components and electromechanical components).

Study A addresses requirements needed in the production of high-reliability electronic control units (ECU), as for example in automotive electronics. These requirements include measurement and production tolerances.

Study B represents consumer electronics products and includes reflow oven capability, board design and package sizes.

Electrical components, Environmental testing, Solders, Printed-circuit boards, Solderability testing, Electrical equipment, Thermal testing, Electronic equipment and components, Thermal resistance, Heating tests, Testing conditions, Lead-free alloys
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