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Normas BSI – AENOR
BS EN 60191-6-13:2016

BS EN 60191-6-13:2016

Mechanical standardization of semiconductor devices. Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

Fecha:
2016-12-31 /Definitive
Comité:
EPL/47
Equivalencias internacionales:

EN 60191-6-13:2016

IEC 60191-6-13:2016

Relación con otras normas BSI:

Reemplaza a: BS EN 60191-6-13:2007

Resumen:
IEC 60191-6-13:2016 specifies a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this part of IEC 60191 establishes the outline drawings and dimensions of the open-top-type test and burn-in sockets applied to FBGA and FLGA. This edition includes the following significant technical changes with respect to the previous edition:
a) BGA package nominal length and width have been newly expanded to 43 mm and 43 mm, respectively. Accordingly, six socket sizes have been added to the socket group numbers 1, 2 and 3, and twenty-two socket sizes have been added to the socket group number 4.
Keywords:
Symbols, Packages, Technical drawing, Engineering drawings, Integrated circuits, Dimensions, Standardization, Semiconductor devices, Printed-circuit boards, Designations, Drawings, Electronic equipment and components
200,62
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