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Normas BSI – AENOR
PD IEC/TS 62878-2-3:2015

PD IEC/TS 62878-2-3:2015

Device embedded substrate. Guidelines. Design guide

Fecha:
2015-04-30 /Definitive
Comité:
EPL/501
Equivalencias internacionales:

IEC TS 62878-2-3:2015

Resumen:
IEC TS 62878-2-3:2015 describes the design guide of device embedded substrates. The design guide of device embedded substrate is essentially the same as that of various electronic circuit boards. This part of IEC 62878 enables a thorough understanding of circuit design, structure design, board design, board manufacturing, jisso (assembly processes) and tests of products. It is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.
Keywords:
Accuracy, Environmental testing, Precision, Printed circuits, Mechanical testing, Specimen preparation, Visual inspection (testing), Approval testing, Statistical methods of analysis, Printed-circuit boards, Electronic equipment and components, Electrical testing, Chemical analysis and testing, Electrical insulating materials
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