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Normas BSI – AENOR
BS EN 62047-14:2012

BS EN 62047-14:2012

Semiconductor devices. Micro-electromechanical devices. Forming limit measuring method of metallic film materials

Fecha:
2012-05-31 /Definitive
Comité:
EPL/47
Equivalencias internacionales:

EN 62047-14:2012

IEC 62047-14:2012

Resumen:
IEC 62047-14:2012 describes definitions and procedures for measuring the forming limit of metallic film materials with a thickness range from 0,5 ?m to 300 ?m. The metallic film materials described herein are typically used in electric components, MEMS and micro-devices. When metallic film materials used in MEMS (see 2.1.2 of IEC 62047-1:2005) are fabricated by a forming process such as imprinting, it is necessary to predict the material failure in order to increase the reliability of the components. Through this prediction, the effectiveness of manufacturing MEMS components by a forming process can also be improved, because the period of developing a product can be reduced and manufacturing costs can thus be decreased. This standard presents one of the prediction methods for material failure in imprinting process.
Keywords:
Electronic equipment and components, Test specimens, Vibration, Resonance, Thin-film devices, Bend testing, Electromechanical devices, Semiconductor technology, Semiconductor devices, Fatigue testing, Integrated circuits, Test equipment
146,07
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