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Normas BSI – AENOR
BS EN 62047-10:2011

BS EN 62047-10:2011

Semiconductor devices. Micro-electromechanical devices. Micro-pillar compression test for MEMS materials

2011-09-30 /Definitive
Equivalencias internacionales:

EN 62047-10:2011

IEC 62047-10:2011

IEC 62047-10:2011 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a specimen is measured, and the compressive modulus of elasticity and yield strength can be obtained. This standard is applicable to metallic, ceramic, and polymeric materials. The contents of the corrigendum of February 2012 have been included in this copy.
Compression testing, Semiconductor technology, Test specimens, Electronic equipment and components, Stress, Integrated circuits, Electromechanical devices, Semiconductor devices, Strain measurement
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