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Normas BSI – AENOR
BS EN 60068-2-20:2008

BS EN 60068-2-20:2008

Environmental testing. Tests. Test T. Test methods for solderability and resistance to soldering heat of devices with leads

2009-01-31 /Revision Underway
Equivalencias internacionales:

EN 60068-2-20:2008

EN 60115-9-1:2004

IEC 60068-2-20:2008

Relación con otras normas BSI:

Reemplaza a: BS 2011-2.1T:1981

IEC 60068-2-20:2008 outlines Test T, applicable to devices with leads. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures in this standard include the solder bath method and soldering iron method. The objective of this standard is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition, test methods are provided to ensure that the component body can resist against the heat load to which it is exposed during soldering. The major technical changes with regard to the fourth edition are the following:
- the solder globule test is deleted;
- test conditions and requirements for lead-free solders are added.
Heating tests, Electrical components, Fluxes (materials), Soldering, Ageing (materials), Specimen preparation, Environmental testing, Thermal resistance, Electrical equipment, Testing conditions, Wettability, Printed-circuit boards, Test equipment, Thermal testing, Electronic equipment and components
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