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Normas BSI – AENOR
BS EN 61188-5-6:2003

BS EN 61188-5-6:2003

Printed boards and assemblies. Design and use. Attachment (land/joint) considerations. Chip carriers with J-leads on four sides

2003-06-26 /Definitive
Equivalencias internacionales:

EN 60601-1-1:2001

EN 61188-5-6:2003

IEC 61188-5-6:2003

Provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. Provides the appropriate size, shape and tolerances of surface mount land patterns so as to ensure sufficient area for the appropriate solder fillet, and also allows for inspection, testing and reworking of resulting solder joints.
Printed-circuit boards, Design, Electronic equipment and components, Soldering, Printed circuits, Dimensions, Integrated circuits, Dimensional tolerances
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