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Normas BSI – AENOR
BS EN 61192-3:2003

BS EN 61192-3:2003

Workmanship requirements for soldered electronic assemblies. Through-hole mount assemblies

Fecha Anulación:
2019-05-08 /Withdrawn
Comité:
EPL/501
Equivalencias internacionales:

EN 61192-3 (IEC 61192-3:2002) AS

IEC 61192-3:2002

Resumen:
Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies that include surface-mounting or other related assembly technologies, for example, terminals, wires.
Keywords:
Assessed quality, Printed circuits, Assembling, Soldering, Electronic equipment and components, Laminates, Printed-circuit boards
269,36
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Formato digital

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