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Normas BSI – AENOR
BS EN 61190-1-3:2002

BS EN 61190-1-3:2002

Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

Fecha Anulación:
2007-07-31 /Withdrawn
Comité:
EPL/501
Equivalencias internacionales:

EN 61190-1-3 (IEC 61190-1-3:2002 AS)

IEC 61190-1-3:2002

Relación con otras normas BSI:

Reemplazada por: BS EN 61190-1-3:2007+A1:2010

Resumen:
Prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, and powder solders, other than solder paste, for electronic soldering applications as well as for special electronic grade solders. This standard is a quality control document (not intended to relate directly to the material performance in the manufacturing process).
Keywords:
Quality control, Particulate materials, Quality assurance, Electronic engineering, Soldering, Fluxes (materials), Electrical connections, Solders, Bonding, Bars (materials), Electronic equipment and components
254,09
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Formato digital

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