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Normas BSI – AENOR
BS EN 60249-1:1993, IEC 60249-1:1982

BS EN 60249-1:1993, IEC 60249-1:1982

Base materials for printed circuits. Base materials for printed circuits. Test methods

Fecha Anulación:
2006-10-01 /Withdrawn
Comité:
EPL/501
Equivalencias internacionales:

EN 60249-1:1993

IEC 60249-1:1982

Keywords:
Films (states of matter), Density measurement, Visual inspection (testing), Blistering, Adhesion tests, Coated materials, Test equipment, Metal coatings, Dimensional measurement, Dimensional changes, Specimen preparation, Electronic equipment and components, Corrosion tests, Surface defects, Flammability, Bend testing, Flatness measurement, Test specimens, Damp-heat tests, Laminates, Fatigue testing, Resistance measurement, Fire tests, Printed-circuit bases, Electrical testing, Sample location, Peeling tests, Weight measurement, Foil, Sheet materials, Dimensions, Copper, Dielectric-strength tests, Mechanical testing, Thickness measurement, Printed circuits, Printed-circuit boards, Humidity, Permittivity measurement, Thermal testing, Dissipation factor, Thermal-shock tests, Strength of materials, Tracking tests, High-temperature testing, Environmental testing, Solderability testing
303,04
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Formato digital

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