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ASTM D7836-13

ASTM D7836-13

Standard Test Methods for Measurement of Yield Stress of Paints, Inks and Related Liquid Materials

2016-12-27 /Active
Significance and Use:

5.1 The yield stress of a material is a measure of the amount of force required to initiate movement of that material in a pipe, through a pump, or from nozzle. The yield stress also characterizes the ability of the material to maintain particles in suspension. Along with viscosity measurements, yield stress measurements have been useful in establishing root causes of flow problems such as excessive orange peel and sagging and in explaining resistance to such problems. After a coating has been applied, flow and leveling tends to be inversely related to yield stress and sag resistance tends to be directly related to yield stress. The ability of an automotive basecoat to keep aluminum and/or mica flakes oriented has been related to yield stress (direct relationship).


1.1 These test methods cover three approaches for determining yield stress values of paints, inks and related liquid materials using rotational viscometers. The first method uses a rotational viscometer with coaxial cylinder, cone/plate, or plate/plate geometry. The second method uses a rheometer operating in controlled stress mode with similar geometries. The third method uses a viscometer with a vane spindle.

1.2 A non-rotational technique, the falling needle viscometer (FNV), also can be used to measure yield stress values in paints, inks and related materials. See Test Methods D5478, Test Method D, Yield Stress Determination for details.

1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

coaxial cylinder geometry; cone/plate geometry; controlled stress rheometer; rotational speed; rotational viscometer; shear rate; shear stress; vane spindle geometry; yield stress
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