Standard Specification for Polymeric Resin Film for Electrical Insulation and Dielectric Applications
This specification establishes the requirements for the material, dimensions and tolerances, and property values of polymeric resin films, in sheet or strip form, for use in electrical insulation and dielectric applications. Type I are flexible unsupported films for general purpose, while Type II are heat-sealable coated on one (Grade 1) or both (Grade 2) sides. Materials covered here are (A) poly(N,N'-p,p'-oxydiphenylene pyromellitimide), (B) poly(N,N'-p,p'-oxydiphenylene biphenyltetracarboxylimide, (C) poly(N,N'-p-phenylene biphenyltetracarboxylimide), (D) FEP-fluorocarbon, (E) polyethylene terephthalate, (F) polyethylene naphthalate, and (G) polyetherimide. Individual materials class of films shall be tested and conform accordingly the following property values: tensile strength; elongation; shrinkage; moisture absorption; dielectric strength; volume resistivity; permittivity; and dissipation factor.
1.1 This specification covers requirements for the material, dimensions and tolerances, and property values of film, in sheet or strip form, with or without heat-sealable coatings.
1.2 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.
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