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Normas ASTM – AENOR
ASTM B32-08

ASTM B32-08

Standard Specification for Solder Metal

Fecha:
2014-10-15 /Historical
Superseeded by:
Abstract:

This specification covers solder metal alloys (also known as soft solders) used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tin-antimony-copper-silver, tin-antimony-copper-silver-nickel, tin-silver, tin-copper-silver, and lead-tin-silver, used for the purpose of joining together two or more metals at temperatures below their melting points. Included here are solders in the form of solid bars, ingots, powder and special forms, and in the form of solid and flux-core ribbons, wires, and solder pastes. Electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications are not taken into account here. Solder alloys shall adhere to chemical composition requirements specified for the following flux types: Types R, RMA, and RA, which are composed of Grade WW or WG gum rosin; Type OA, which is composed of water-soluble organic materials; Type OS, which is composed of water-insoluble organic materials; and Type IS, which is composed of inorganic saltsor acids. Solders shall also meet physical property requirements such as paste texture, powder mesh size, viscosity, solder pool, and dryness, and pass performance requirements such as chlorides and bromides test, copper mirror test, and visual inspection. Other properties to which the alloys should conform to are dimensions and unit weights, spread factor, and resistivity of water extract.

Scope:

1.1 This specification covers solder metal alloys (commonly known as soft solders) used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tin-antimony-copper-silver, tin-antimony-copper-silver-nickel, tin-silver, tin-copper-silver, and lead-tin-silver, used for the purpose of joining together two or more metals at temperatures below their melting points. Electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications are not covered by this specification as they are under the auspices of IPC Association Connecting Electronic Industries.

1.1.1 These solders include those alloys having a liquidus temperature not exceeding 800°F (430°C).

1.1.2 This specification includes solders in the form of solid bars, ingots, powder and special forms, and in the form of solid and flux-core ribbon, wire, and solder paste.

1.2 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard.

1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to become familiar with all hazards including those identified in the appropriate Material Safety Data Sheet (MSDS) for this product/material as provided by the manufacturer, to establish appropriate safety and health practices, and determine the applicability of regulatory limitations prior to use.

Keywords:
bar; flux; flux cored solder; ingot; lead<span class='unicode'>&#x2013;</span>silver alloys; lead<span class='unicode'>&#x2013;</span>tin alloys; lead<span class='unicode'>&#x2013;</span>tin<span class='unicode'>&#x2013;</span>silver alloys; powder; ribbon; solder alloy; solder metal; solder uses; tin<span class='unicode'>&#x2013;</span>antimony alloys; tin<span class='unicode'>&#x2013;</span>copper alloys; tin<span class='unicode'>&#x2013;</span>silver alloys; wire; Lead metals/alloys--specifications; Lead-tin alloys/coatings--specifications; Powder metallurgy--specifications; Solder/soldering applications--specifications; Core solder; Flux cored solder; Ingots; Lead-silver alloys; Lead-tin-silver alloys; Tin-antimony alloys; Tin-copper alloys; Tin-silver alloys
49,73
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