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Normas ASTM – AENOR
ASTM F584-06e1

ASTM F584-06e1

Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire (Withdrawn 2015)

Fecha:
2015-01-14 /Withdrawn
No replacement
Significance and Use:

Spooled wire viewed under bright direct lighting or in deep shadow generally exhibits a flawless appearance. Proper arrangement of the viewing angle and illumination, however, permits accurate observation of wire-surface condition. This practice specifies the conditions under which reliable and reproducible surface finish inspection may be achieved. Such inspection is appropriate for evaluating surface quality with respect to the requirements in Specifications F 72 and F 487.

Surface smoothness and degree of cleanliness may affect the performance of wire. This practice may be used to determine whether or not spooled wire meets performance-based surface finish criteria agreed upon between a manufacturer or supplier and a wire purchaser.

The magnification recommended may not be sufficient to permit detection of all defects on the wire surface affecting wire performance; however, it is sufficient to permit an inspector to determine the overall state of the wire finish and the manner in which the wire lies on the spool.

Scope:

1.1 This practice covers conditions for nondestructive visual inspection of the surface finish of spooled aluminum and gold wire used for making internal semiconductor device connections and hybrid microelectronic connections.

1.2 This practice specifies the recommended lighting, magnification, and specimen positioning for inspecting spooled wire under an optical microscope.

1.3 Photographs ( ) are included in as guides to aid the inspector in identifying particular surface conditions. These photographs are not intended as standards for specifying wire surface quality.

1.4 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.

This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the aplicability of regulatory limitations prior to use.

Keywords:
bonding wire; inspection; lead-bonding wire; semiconductor packaging; visual inspection; wire
50,76
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