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ASTM F357-78(2002)

ASTM F357-78(2002)

Standard Practice for Determining Solderability of Thick Film Conductors (Withdrawn 2008)

2008-07-31 /Withdrawn
No replacement
Significance and Use:

The procedure of this practice is suitable for process control.

No interlaboratory precision has been established for the procedure of this practice. Therefore, this practice should not be used for the acceptance or rejection of material exchanged between buyers and sellers.


1.1 This practice covers a procedure for determining the solderability of thick-film conductors. The procedure has been adapted from several techniques that are in routine use for testing this property.

1.2 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.

1.3 This standard does not purport to address the safety concerns, if any, associated with its use. It is the responsibility of whoever uses this standard to consult and establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

hybrid microcircuits; solderability; solder wetting; thick-film metallization
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